FDC37C669QFP

FDC37C669QFP

QFP, QFP100,.63SQ,20

Call for availability

Manufactured by:

SMSC

Mfr Part#:  FDC37C669QFP

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP100,.63SQ,20

PACKAGE EQUIVALENCE CODE:  QFP100,.63SQ,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

DATA TRANSFER RATE-MAX:  0.25 MBPS

DRIVE INTERFACE STANDARD:  IDE

EXTERNAL DATA BUS WIDTH:  8

HOST INTERFACE STANDARD:  PC-AT; PC-XT; PS/2; ISA

JESD-30 CODE:  R-PQFP-G100

JESD-609 CODE:  E0

LENGTH:  20 MM

MANUFACTURER:  SMSC

MANUFACTURER PART NUMBER:  FDC37C669QFP

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  100

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP100,.63SQ,20

PACKAGE EQUIVALENCE CODE:  QFP100,.63SQ,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

PEAK REFLOW TEMPERATURE (CEL):  220

PIN COUNT:  100

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  3.15 MM

SUBCATEGORY:  SECONDARY STORAGE CONTROLLERS

SUPPLY CURRENT-MAX:  35 MA

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE

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