SSD1926QL9

SSD1926QL9

LFQFP

Call for availability

Manufactured by:

SOLOMON

Mfr Part#:  SSD1926QL9

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PQFP-G128

LENGTH:  14 MM

MANUFACTURER:  SOLOMON SYSTECH

MANUFACTURER PART NUMBER:  SSD1926QL9

NUMBER OF TERMINALS:  128

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -30 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

PIN COUNT:  128

SEATED HEIGHT-MAX:  1.6 MM

SUPPLY VOLTAGE-MAX:  1.98 V

SUPPLY VOLTAGE-MIN:  1.62 V

SUPPLY VOLTAGE-NOM:  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  400 ΜM

TERMINAL POSITION:  QUAD

WIDTH:  14 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR CIRCUIT

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