CXN1000-3BAL
MODULE(UNSPEC)Call for availability
Manufactured by:
Mfr Part#: CXN1000-3BAL
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE DESCRIPTION: , MODULE(UNSPEC)
PACKAGE EQUIVALENCE CODE: MODULE(UNSPEC)
PACKAGE STYLE: MICROELECTRONIC ASSEMBLY
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
MANUFACTURER: SONY SEMICONDUCTOR
MANUFACTURER PART NUMBER: CXN1000-3BAL
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE DESCRIPTION: , MODULE(UNSPEC)
PACKAGE EQUIVALENCE CODE: MODULE(UNSPEC)
PACKAGE STYLE: MICROELECTRONIC ASSEMBLY
POWER SUPPLIES: 3/3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: OTHER TELECOM ICS
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
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