ICX038DLA

ICX038DLA

WSDIP

Call for availability

Manufactured by:

SONY SEMICONDUCTOR

Mfr Part#:  ICX038DLA

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  WSDIP

PACKAGE DESCRIPTION:  WSDIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE, WINDOW, SHRINK PITCH

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ANALOG IC - OTHER TYPE:  ANALOG CIRCUIT

JESD-30 CODE:  R-GDIP-T20

JESD-609 CODE:  E0

LENGTH:  18 MM

MANUFACTURER:  SONY SEMICONDUCTOR

MANUFACTURER PART NUMBER:  ICX038DLA

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  20

OPERATING TEMPERATURE-MAX:  60 °C

OPERATING TEMPERATURE-MIN:  -10 °C

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  WSDIP

PACKAGE DESCRIPTION:  WSDIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE, WINDOW, SHRINK PITCH

PART PACKAGE CODE:  DIP

PIN COUNT:  20

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  4.97 MM

SUPPLY VOLTAGE-MAX (VSUP):  15.45 V

SUPPLY VOLTAGE-MIN (VSUP):  14.55 V

SUPPLY VOLTAGE-NOM (VSUP):  15 V

SURFACE MOUNT:  NO

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  1.778 MM

TERMINAL POSITION:  DUAL

WIDTH:  15.24 MM

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