AM27C512-255PC

AM27C512-255PC

DIP

Call for availability

Manufactured by:

SPANSION

Mfr Part#:  AM27C512-255PC

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  250 NS

JESD-30 CODE:  R-PDIP-T28

LENGTH:  37.084 MM

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  AM27C512-255PC

MEMORY DENSITY:  524.288 KBIT

MEMORY IC TYPE:  OTP ROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

NUMBER OF WORDS:  65.536 K

NUMBER OF WORDS CODE:  64000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  64KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PIN COUNT:  28

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.715 MM

SUPPLY VOLTAGE-MAX (VSUP):  5.25 V

SUPPLY VOLTAGE-MIN (VSUP):  4.75 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

WIDTH:  15.24 MM

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