AM29F200BB-70EI
TSSOP, TSSOP48,.8,20Call for availability
Mfr Part#: AM29F200BB-70EI
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP48,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP48,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSOP1
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 70 NS
ADDITIONAL FEATURE: MIN 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK
ALTERNATE MEMORY WIDTH: 8
BOOT BLOCK: BOTTOM
COMMAND USER INTERFACE: YES
DATA POLLING: YES
ENDURANCE: 1000000 WRITE/ERASE CYCLES
JESD-30 CODE: R-PDSO-G48
JESD-609 CODE: E0
LENGTH: 18.4 MM
MANUFACTURER: SPANSION
MANUFACTURER PART NUMBER: AM29F200BB-70EI
MEMORY DENSITY: 2.0972 MBIT
MEMORY IC TYPE: FLASH
MEMORY WIDTH: 16
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF SECTORS/SIZE: 1,2,1,3
NUMBER OF TERMINALS: 48
NUMBER OF WORDS: 131.072 K
NUMBER OF WORDS CODE: 128000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 128KX16
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP48,.8,20
PACKAGE EQUIVALENCE CODE: TSSOP48,.8,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: TSOP1
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): 240
PIN COUNT: 48
POWER SUPPLIES: 5 V
PROGRAMMING VOLTAGE: 5 V
QUALIFICATION STATUS: NOT QUALIFIED
READY/BUSY: YES
SEATED HEIGHT-MAX: 1.2 MM
SECTOR SIZE: 16K,8K,32K,64K
STANDBY CURRENT-MAX: 5 ΜA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 60 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 4.5 V
SUPPLY VOLTAGE-NOM (VSUP): 5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
TOGGLE BIT: YES
TYPE: NOR TYPE
WIDTH: 12 MM
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