S25FL032A0LMFI001

S25FL032A0LMFI001

SOP, SOP16,.4

Call for availability

Manufactured by:

SPANSION

Mfr Part#:  S25FL032A0LMFI001

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP16,.4

PACKAGE EQUIVALENCE CODE:  SOP16,.4

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CLOCK FREQUENCY-MAX (FCLK):  50 MHZ

DATA RETENTION TIME-MIN:  20

ENDURANCE:  100000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PDSO-G16

JESD-609 CODE:  E3

LENGTH:  10.3 MM

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  S25FL032A0LMFI001

MEMORY DENSITY:  33.5544 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  1

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  16

NUMBER OF WORDS:  33.5544 M

NUMBER OF WORDS CODE:  32000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  32MX1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP16,.4

PACKAGE EQUIVALENCE CODE:  SOP16,.4

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  SOIC

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  16

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.65 MM

SERIAL BUS TYPE:  SPI

STANDBY CURRENT-MAX:  50 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  19 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

TYPE:  NOR TYPE

WIDTH:  7.5 MM

WRITE PROTECTION:  HARDWARE/SOFTWARE

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