S25FL164K0XNFIQ10

S25FL164K0XNFIQ10

HVSON

Call for availability

Manufactured by:

SPANSION

Mfr Part#:  S25FL164K0XNFIQ10

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  ALSO CONFIGURABLE AS 64M X 1

ALTERNATE MEMORY WIDTH:  2

CLOCK FREQUENCY-MAX (FCLK):  108 MHZ

JESD-30 CODE:  R-PDSO-N8

JESD-609 CODE:  E3

LENGTH:  6 MM

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  S25FL164K0XNFIQ10

MEMORY DENSITY:  67.1089 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  4

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  16.7772 M

NUMBER OF WORDS CODE:  16000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  16MX4

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

PARALLEL/SERIAL:  SERIAL

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PROGRAMMING VOLTAGE:  3 V

SEATED HEIGHT-MAX:  800 ΜM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  5 MM

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