S29AL016J70FFI010

S29AL016J70FFI010

9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64

Call for availability

Manufactured by:

SPANSION

Mfr Part#:  S29AL016J70FFI010

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64

PACKAGE EQUIVALENCE CODE:  BGA64,8X8,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  70 NS

ADDITIONAL FEATURE:  TOP BOOT BLOCK

ALTERNATE MEMORY WIDTH:  8

BOOT BLOCK:  TOP

COMMAND USER INTERFACE:  YES

COMMON FLASH INTERFACE:  YES

DATA POLLING:  YES

JESD-30 CODE:  S-PBGA-B64

LENGTH:  9 MM

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  S29AL016J70FFI010

MEMORY DENSITY:  16.7772 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF SECTORS/SIZE:  1,2,1,31

NUMBER OF TERMINALS:  64

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  1MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64

PACKAGE EQUIVALENCE CODE:  BGA64,8X8,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PIN COUNT:  64

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

READY/BUSY:  YES

SEATED HEIGHT-MAX:  1.4 MM

SECTOR SIZE:  16K,8K,32K,64K

STANDBY CURRENT-MAX:  5 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  30 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TOGGLE BIT:  YES

TYPE:  NOR TYPE

WIDTH:  9 MM

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