S29AL016J70FFI010
9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64Call for availability
Mfr Part#: S29AL016J70FFI010
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LBGA
PACKAGE DESCRIPTION: 9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64
PACKAGE EQUIVALENCE CODE: BGA64,8X8,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, LOW PROFILE
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 70 NS
ADDITIONAL FEATURE: TOP BOOT BLOCK
ALTERNATE MEMORY WIDTH: 8
BOOT BLOCK: TOP
COMMAND USER INTERFACE: YES
COMMON FLASH INTERFACE: YES
DATA POLLING: YES
JESD-30 CODE: S-PBGA-B64
LENGTH: 9 MM
MANUFACTURER: SPANSION
MANUFACTURER PART NUMBER: S29AL016J70FFI010
MEMORY DENSITY: 16.7772 MBIT
MEMORY IC TYPE: FLASH
MEMORY WIDTH: 16
NUMBER OF FUNCTIONS: 1
NUMBER OF SECTORS/SIZE: 1,2,1,31
NUMBER OF TERMINALS: 64
NUMBER OF WORDS: 1.0486 M
NUMBER OF WORDS CODE: 1000000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 1MX16
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LBGA
PACKAGE DESCRIPTION: 9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64
PACKAGE EQUIVALENCE CODE: BGA64,8X8,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, LOW PROFILE
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: BGA
PIN COUNT: 64
POWER SUPPLIES: 3/3.3 V
PROGRAMMING VOLTAGE: 3 V
QUALIFICATION STATUS: NOT QUALIFIED
READY/BUSY: YES
SEATED HEIGHT-MAX: 1.4 MM
SECTOR SIZE: 16K,8K,32K,64K
STANDBY CURRENT-MAX: 5 ΜA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 30 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 2.7 V
SUPPLY VOLTAGE-NOM (VSUP): 3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM
TOGGLE BIT: YES
TYPE: NOR TYPE
WIDTH: 9 MM
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