S29CL032J0PQFM010
QFP, QFP80,.7X.9,32Call for availability
Mfr Part#: S29CL032J0PQFM010
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, QFP80,.7X.9,32
PACKAGE EQUIVALENCE CODE: QFP80,.7X.9,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: FLATPACK
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS TIME-MAX: 54 NS
ADDITIONAL FEATURE: SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
BOOT BLOCK: BOTTOM
COMMAND USER INTERFACE: YES
COMMON FLASH INTERFACE: YES
DATA POLLING: YES
JESD-30 CODE: R-PQFP-G80
JESD-609 CODE: E3
LENGTH: 20 MM
MANUFACTURER: SPANSION
MANUFACTURER PART NUMBER: S29CL032J0PQFM010
MEMORY DENSITY: 33.5544 MBIT
MEMORY IC TYPE: FLASH
MEMORY WIDTH: 32
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF SECTORS/SIZE: 16,62
NUMBER OF TERMINALS: 80
NUMBER OF WORDS: 1.0486 M
NUMBER OF WORDS CODE: 1000000
OPERATING MODE: ASYNCHRONOUS
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 1MX32
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, QFP80,.7X.9,32
PACKAGE EQUIVALENCE CODE: QFP80,.7X.9,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: FLATPACK
PARALLEL/SERIAL: PARALLEL
PART PACKAGE CODE: QFP
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 80
POWER SUPPLIES: 1.8/3.3,3.3 V
PROGRAMMING VOLTAGE: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
READY/BUSY: YES
SEATED HEIGHT-MAX: 3.35 MM
SECTOR SIZE: 2K,16K
STANDBY CURRENT-MAX: 60 ΜA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 90 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 3 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: MATTE TIN (SN)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
TOGGLE BIT: YES
TYPE: NOR TYPE
WIDTH: 14 MM
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