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TECHNOLOGY: THICK FILM - GENERAL PURPOSE
CONSTRUCTION: CHIP
JESD-609 CODE: E3
MANUFACTURER: SEI STACKPOLE ELECTRONICS INC
MANUFACTURER PART NUMBER: RMCF0402JT33R0
MOUNTING FEATURE: SURFACE MOUNT
NUMBER OF TERMINALS: 2
OPERATING TEMPERATURE-MAX: 155 °C
OPERATING TEMPERATURE-MIN: -55 °C
PACKAGE DESCRIPTION: SMT, 0402
PACKAGE HEIGHT: 300 ΜM
PACKAGE LENGTH: 1 MM
PACKAGE SHAPE: RECTANGULAR PACKAGE
PACKAGE STYLE: SMT
PACKAGE WIDTH: 500 ΜM
PACKING METHOD: TR, PAPER, 7 INCH
PBFREE CODE: YES
RATED POWER DISSIPATION (P): 63 MW
RATED TEMPERATURE: 70 °C
REFERENCE STANDARD: AEC-Q200
RESISTANCE: 33 O
RESISTOR TYPE: FIXED RESISTOR
SIZE CODE: 0402
SUBCATEGORY: FIXED RESISTOR
SURFACE MOUNT: YES
TECHNOLOGY: METAL GLAZE/THICK FILM
TEMPERATURE COEFFICIENT: 100 PPM/°C
TERMINAL FINISH: MATTE TIN (SN) - WITH NICKEL (NI) BARRIER
TERMINAL SHAPE: WRAPAROUND
TOLERANCE: 5 %
WORKING VOLTAGE: 50 V
TECHNOLOGY: Thick film - General Purpose
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