TECHNOLOGY:  THICK FILM - GENERAL PURPOSE

CONSTRUCTION:  CHIP

JESD-609 CODE:  E3

MANUFACTURER:  SEI STACKPOLE ELECTRONICS INC

MANUFACTURER PART NUMBER:  RMCF0805FT165K

MOUNTING FEATURE:  SURFACE MOUNT

NUMBER OF TERMINALS:  2

OPERATING TEMPERATURE-MAX:  155 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  SMT, 0805

PACKAGE HEIGHT:  500 ΜM

PACKAGE LENGTH:  2 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  1.25 MM

PACKING METHOD:  TR, PAPER, 7 INCH

PBFREE CODE:  YES

RATED POWER DISSIPATION (P):  125 MW

RATED TEMPERATURE:  70 °C

REFERENCE STANDARD:  AEC-Q200

RESISTANCE:  165 KO

RESISTOR TYPE:  FIXED RESISTOR

SIZE CODE:  0805

SUBCATEGORY:  FIXED RESISTOR

SURFACE MOUNT:  YES

TECHNOLOGY:  METAL GLAZE/THICK FILM

TEMPERATURE COEFFICIENT:  100 PPM/°C

TERMINAL FINISH:  MATTE TIN (SN) - WITH NICKEL (NI) BARRIER

TERMINAL SHAPE:  WRAPAROUND

TOLERANCE:  1 %

WORKING VOLTAGE:  150 V

TECHNOLOGY:  Thick film - General Purpose