TMS320C6416TBGLZA7
HFBGA, BGA532,26X26,32Call for availability
Mfr Part#: TMS320C6416TBGLZA7
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HFBGA
PACKAGE DESCRIPTION: HFBGA, BGA532,26X26,32
PACKAGE EQUIVALENCE CODE: BGA532,26X26,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO REQUIRES 3.3V SUPPLY
ADDRESS BUS WIDTH: 23
BARREL SHIFTER: NO
BIT SIZE: 32
BOUNDARY SCAN: YES
BRAND NAME: TEXAS INSTRUMENTS
CLOCK FREQUENCY-MAX: 75.18 MHZ
EXTERNAL DATA BUS WIDTH: 64
FORMAT: FIXED POINT
INTERNAL BUS ARCHITECTURE: MULTIPLE
JESD-30 CODE: S-PBGA-B532
LENGTH: 23 MM
LOW POWER MODE: YES
MANUFACTURER: TEXAS INSTRUMENTS
MANUFACTURER PART NUMBER: TMS320C6416TBGLZA7
NUMBER OF TERMINALS: 532
OPERATING TEMPERATURE-MAX: 105 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HFBGA
PACKAGE DESCRIPTION: HFBGA, BGA532,26X26,32
PACKAGE EQUIVALENCE CODE: BGA532,26X26,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
PART PACKAGE CODE: BGA
PBFREE CODE: NO
PIN COUNT: 532
POWER SUPPLIES: 1.2,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (WORDS): 16384
SEATED HEIGHT-MAX: 3.3 MM
SUBCATEGORY: DIGITAL SIGNAL PROCESSORS
SUPPLY VOLTAGE-MAX: 1.24 V
SUPPLY VOLTAGE-MIN: 1.16 V
SUPPLY VOLTAGE-NOM: 1.2 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: BALL
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: BOTTOM
WIDTH: 23 MM
UPS/UCS/PERIPHERAL ICS TYPE: DIGITAL SIGNAL PROCESSOR, OTHER
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