XC6209A182DR

XC6209A182DR

HVSON, SOLCC6,.08,20

Call for availability

Manufactured by:

TOREX SEMICONDUCTOR LTD.

Mfr Part#:  XC6209A182DR

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON, SOLCC6,.08,20

PACKAGE EQUIVALENCE CODE:  SOLCC6,.08,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

PACKING METHOD:  TAPE AND REEL

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADJUSTABILITY:  FIXED

DROPOUT VOLTAGE1-MAX:  400 MV

DROPOUT VOLTAGE1-NOM:  300 MV

FEATURE:  FIXED,POSITIVE,SINGLE OUTPUT,LDO

INPUT VOLTAGE ABSOLUTE-MAX:  12 V

INPUT VOLTAGE-MAX:  10 V

INPUT VOLTAGE-MIN:  2 V

JESD-30 CODE:  R-PDSO-N6

LENGTH:  2 MM

LINE REGULATION-MAX:  0.02592 %

LOAD REGULATION-MAX:  0.05 %

MANUFACTURER:  TOREX SEMICONDUCTOR LTD

MANUFACTURER PART NUMBER:  XC6209A182DR

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF OUTPUTS:  1

NUMBER OF TERMINALS:  6

OUTPUT CURRENT1-MAX:  150 MA

OUTPUT VOLTAGE1-MAX:  1.836 V

OUTPUT VOLTAGE1-MIN:  1.764 V

OUTPUT VOLTAGE1-NOM:  1.8 V

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON, SOLCC6,.08,20

PACKAGE EQUIVALENCE CODE:  SOLCC6,.08,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

PACKING METHOD:  TAPE AND REEL

PART PACKAGE CODE:  SOIC

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  6

QUALIFICATION STATUS:  NOT QUALIFIED

REGULATOR TYPE:  FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

SEATED HEIGHT-MAX:  700 ΜM

SUBCATEGORY:  OTHER REGULATORS

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

VOLTAGE TOLERANCE-MAX:  2 %

WIDTH:  1.8 MM

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