XC6209B302DR
HVSON, SOLCC6,.08,20Call for availability
Mfr Part#: XC6209B302DR
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HVSON
PACKAGE DESCRIPTION: HVSON, SOLCC6,.08,20
PACKAGE EQUIVALENCE CODE: SOLCC6,.08,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: SOIC
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADJUSTABILITY: FIXED
DROPOUT VOLTAGE1-MAX: 270 MV
DROPOUT VOLTAGE1-NOM: 200 MV
FEATURE: FIXED,POSITIVE,SINGLE OUTPUT,LDO
INPUT VOLTAGE ABSOLUTE-MAX: 12 V
INPUT VOLTAGE-MAX: 10 V
INPUT VOLTAGE-MIN: 2 V
JESD-30 CODE: R-PDSO-N6
LENGTH: 2 MM
LINE REGULATION-MAX: 0.036 %
MANUFACTURER: TOREX SEMICONDUCTOR LTD
MANUFACTURER PART NUMBER: XC6209B302DR
NUMBER OF FUNCTIONS: 1
NUMBER OF OUTPUTS: 1
NUMBER OF TERMINALS: 6
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
OUTPUT CURRENT1-MAX: 150 MA
OUTPUT VOLTAGE1-MAX: 3.06 V
OUTPUT VOLTAGE1-MIN: 2.94 V
OUTPUT VOLTAGE1-NOM: 3 V
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HVSON
PACKAGE DESCRIPTION: HVSON, SOLCC6,.08,20
PACKAGE EQUIVALENCE CODE: SOLCC6,.08,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: SOIC
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): NOT SPECIFIED
PIN COUNT: 6
QUALIFICATION STATUS: NOT QUALIFIED
REGULATOR TYPE: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
SEATED HEIGHT-MAX: 700 ΜM
SUBCATEGORY: OTHER REGULATORS
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TERMINAL FORM: NO LEAD
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): NOT SPECIFIED
VOLTAGE TOLERANCE-MAX: 2 %
WIDTH: 1.8 MM
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