WSLP20103L000FEA
SMT, 2010Call for availability
Manufactured by:
Mfr Part#: WSLP20103L000FEA
PACKAGE DESCRIPTION: SMT, 2010
PACKAGE HEIGHT: 635 ΜM
PACKAGE LENGTH: 5.08 MM
PACKAGE STYLE: SMT
PACKAGE WIDTH: 2.54 MM
PACKING METHOD: TR, EMBOSSED PLASTIC, 7 INCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CONSTRUCTION: CHIP
JESD-609 CODE: E3
MANUFACTURER: VISHAY INTERTECHNOLOGIES
MANUFACTURER PART NUMBER: WSLP20103L000FEA
OPERATING TEMPERATURE-MAX: 170 °C
OPERATING TEMPERATURE-MIN: -65 °C
PACKAGE DESCRIPTION: SMT, 2010
PACKAGE HEIGHT: 635 ΜM
PACKAGE LENGTH: 5.08 MM
PACKAGE STYLE: SMT
PACKAGE WIDTH: 2.54 MM
PACKING METHOD: TR, EMBOSSED PLASTIC, 7 INCH
RATED POWER DISSIPATION (P): 2 W
RESISTANCE: 3 MO
RESISTOR TYPE: FIXED RESISTOR
SERIES: WSLP
SIZE CODE: 2010
SUBCATEGORY: FIXED RESISTOR
TECHNOLOGY: METAL STRIP
TEMPERATURE COEFFICIENT: -150,150 PPM/°C
TERMINAL FINISH: MATTE TIN (SN) - WITH NICKEL (NI) BARRIER
TOLERANCE: 1 %
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