VSC850-QG

VSC850-QG

HFQFP

Call for availability

Manufactured by:

VITESSE SEMICONDUCTOR

Mfr Part#:  VSC850-QG

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HFQFP

PACKAGE DESCRIPTION:  HFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, HEAT SINK/SLUG, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BOUNDARY SCAN:  YES

EXTERNAL DATA BUS WIDTH:  16

JESD-30 CODE:  S-PQFP-G208

LENGTH:  28 MM

LOW POWER MODE:  NO

MANUFACTURER:  VITESSE SEMICONDUCTOR CORPORATION

MANUFACTURER PART NUMBER:  VSC850-QG

NUMBER OF TERMINALS:  208

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

OUTPUT DATA BUS WIDTH:  32

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HFQFP

PACKAGE DESCRIPTION:  HFQFP,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, HEAT SINK/SLUG, FINE PITCH

PART PACKAGE CODE:  QFP

PIN COUNT:  208

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  4.07 MM

SUPPLY VOLTAGE-MAX:  3.465 V

SUPPLY VOLTAGE-MIN:  3.135 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

WIDTH:  28 MM

UPS/UCS/PERIPHERAL ICS TYPE:  DSP PERIPHERAL, CROSSBAR SWITCH

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*