LTN20069
HEAT SINK ASSORTED (BGA, LGA, CPU, ASIC...) ALUMINUM BOARD LEVELCall for availability
Manufactured by:
Mfr Part#: LTN20069
PACKAGE COOLED: ASSORTED (BGA, LGA, CPU, ASIC...)
STANDARD PACKAGE: 3,072
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ATTACHMENT METHOD: THERMAL TAPE, ADHESIVE (INCLUDED)
CATEGORIES: FANS, THERMAL MANAGEMENT
DETAILED DESCRIPTION: HEAT SINK ASSORTED (BGA, LGA, CPU, ASIC...) ALUMINUM BOARD LEVEL
HEIGHT OFF BASE (HEIGHT OF FIN): 0.350" (8.89MM)
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
LENGTH: 0.650" (16.51MM)
MANUFACTURER: WAKEFIELD-VETTE
MANUFACTURER PART NUMBER: LTN20069
MANUFACTURER STANDARD LEAD TIME: 12 WEEKS
MATERIAL: ALUMINUM
MATERIAL FINISH: BLACK ANODIZED
MOISTURE SENSITIVITY LEVEL (MSL): 1 (UNLIMITED)
PACKAGE COOLED: ASSORTED (BGA, LGA, CPU, ASIC...)
SERIES: PENGUIN
SHAPE: SQUARE, FINS
STANDARD PACKAGE: 3,072
THERMAL RESISTANCE @ FORCED AIR FLOW: 8.00°C/W @ 500 LFM
TYPE: BOARD LEVEL
WIDTH: 0.653" (16.59MM)
Related Products
MFR. Name: Aavid Thermalloy
MFR. Name: Aavid Thermalloy
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