PC87309-ICK/VLJ

PC87309-ICK/VLJ

QFP

Call for availability

Manufactured by:

WINBOND

Mfr Part#:  PC87309-ICK/VLJ

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  12

BOUNDARY SCAN:  NO

BUS COMPATIBILITY:  EISA; ISA; MICROCHANNEL

CLOCK FREQUENCY-MAX:  48 MHZ

EXTERNAL DATA BUS WIDTH:  8

JESD-30 CODE:  R-PQFP-G100

JESD-609 CODE:  E0

LENGTH:  20 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  PC87309-ICK/VLJ

MOISTURE SENSITIVITY LEVEL:  2A

NUMBER OF I/O LINES:  8

NUMBER OF TERMINALS:  100

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

PART PACKAGE CODE:  QFP

PEAK REFLOW TEMPERATURE (CEL):  220

PIN COUNT:  100

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  256

SEATED HEIGHT-MAX:  3 MM

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM

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