W24258-70LE

W24258-70LE

DIP, DIP28,.6

Call for availability

Manufactured by:

WINBOND

Mfr Part#:  W24258-70LE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP28,.6

PACKAGE EQUIVALENCE CODE:  DIP28,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  100 NS

I/O TYPE:  COMMON

JESD-30 CODE:  R-PDIP-T28

JESD-609 CODE:  E0

LENGTH:  37.08 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W24258-70LE

MEMORY DENSITY:  262.144 KBIT

MEMORY IC TYPE:  STANDARD SRAM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -20 °C

ORGANIZATION:  32KX8

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP28,.6

PACKAGE EQUIVALENCE CODE:  DIP28,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  28

POWER SUPPLIES:  3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.33 MM

STANDBY VOLTAGE-MIN:  2 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  70 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.3 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  15.24 MM

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