ACCESS TIME-MAX:  6 NS

I/O TYPE:  COMMON

JESD-30 CODE:  R-PQFP-G100

JESD-609 CODE:  E0

LENGTH:  20 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W25P010AF-6

MEMORY DENSITY:  1.0486 MBIT

MEMORY IC TYPE:  STANDARD SRAM

MEMORY WIDTH:  32

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  100

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  32KX32

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP100,.7X.9

PACKAGE EQUIVALENCE CODE:  QFP100,.7X.9

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  FLATPACK

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  100

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  3.32 MM

STANDBY CURRENT-MAX:  1 MA

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  250 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3.15 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  14 MM