W25Q128BVFIG

W25Q128BVFIG

SOP, SOP16,.4

Call for availability

Manufactured by:

WINBOND

Mfr Part#:  W25Q128BVFIG

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP16,.4

PACKAGE EQUIVALENCE CODE:  SOP16,.4

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CLOCK FREQUENCY-MAX (FCLK):  104 MHZ

DATA RETENTION TIME-MIN:  20

ENDURANCE:  100000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PDSO-G16

JESD-609 CODE:  E3

LENGTH:  10.31 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W25Q128BVFIG

MEMORY DENSITY:  128.0573 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  1

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  16

NUMBER OF WORDS:  134.2177 M

NUMBER OF WORDS CODE:  128000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  128MX1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP16,.4

PACKAGE EQUIVALENCE CODE:  SOP16,.4

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  SOIC

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  16

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  2.7 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.64 MM

SERIAL BUS TYPE:  SPI

STANDBY CURRENT-MAX:  15 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  25 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

TYPE:  NOR TYPE

WIDTH:  7.49 MM

WRITE PROTECTION:  HARDWARE/SOFTWARE

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