W25Q16JVUUIQ

W25Q16JVUUIQ

HVSON

Call for availability

Manufactured by:

WINBOND

Mfr Part#:  W25Q16JVUUIQ

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CLOCK FREQUENCY-MAX (FCLK):  133 MHZ

JESD-30 CODE:  R-PDSO-N8

LENGTH:  4 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W25Q16JVUUIQ

MEMORY DENSITY:  16.7772 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  2.0972 M

NUMBER OF WORDS CODE:  2000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  2MX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

PARALLEL/SERIAL:  SERIAL

PROGRAMMING VOLTAGE:  3 V

SEATED HEIGHT-MAX:  600 ΜM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  DUAL

WIDTH:  3 MM

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