W25Q40BVSNIG

W25Q40BVSNIG

SOP, SOP8,.25

Call for availability

Manufactured by:

WINBOND

Mfr Part#:  W25Q40BVSNIG

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP8,.25

PACKAGE EQUIVALENCE CODE:  SOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CLOCK FREQUENCY-MAX (FCLK):  80 MHZ

DATA RETENTION TIME-MIN:  20

ENDURANCE:  100000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PDSO-G8

LENGTH:  4.85 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W25Q40BVSNIG

MEMORY DENSITY:  4.1943 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  4MX1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP8,.25

PACKAGE EQUIVALENCE CODE:  SOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  SOIC

PIN COUNT:  8

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  2.7 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.72 MM

SERIAL BUS TYPE:  SPI

STANDBY CURRENT-MAX:  5 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  18 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TYPE:  NOR TYPE

WIDTH:  3.9 MM

WRITE PROTECTION:  HARDWARE/SOFTWARE

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