W25X10CLUXIG
HVSON, SOLCC8,.11,20Call for availability
Mfr Part#: W25X10CLUXIG
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HVSON
PACKAGE DESCRIPTION: HVSON, SOLCC8,.11,20
PACKAGE EQUIVALENCE CODE: SOLCC8,.11,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE
PART PACKAGE CODE: SON
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: IT ALSO OPERATES AT 2.3 V AT 80 MHZ
CLOCK FREQUENCY-MAX (FCLK): 104 MHZ
DATA RETENTION TIME-MIN: 20
ENDURANCE: 100000 WRITE/ERASE CYCLES
JESD-30 CODE: R-PDSO-N8
LENGTH: 3 MM
MANUFACTURER: WINBOND ELECTRONICS CORP
MANUFACTURER PART NUMBER: W25X10CLUXIG
MEMORY DENSITY: 1.0486 MBIT
MEMORY IC TYPE: FLASH
MEMORY WIDTH: 1
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 8
NUMBER OF WORDS: 1.0486 M
NUMBER OF WORDS CODE: 1000000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 1MX1
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: HVSON
PACKAGE DESCRIPTION: HVSON, SOLCC8,.11,20
PACKAGE EQUIVALENCE CODE: SOLCC8,.11,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE
PARALLEL/SERIAL: SERIAL
PART PACKAGE CODE: SON
PIN COUNT: 8
POWER SUPPLIES: 2.5/3.3 V
PROGRAMMING VOLTAGE: 3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 600 ΜM
SERIAL BUS TYPE: SPI
STANDBY CURRENT-MAX: 5 ΜA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 15 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 2.7 V
SUPPLY VOLTAGE-NOM (VSUP): 3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FORM: NO LEAD
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TYPE: NOR TYPE
WIDTH: 2 MM
WRITE PROTECTION: HARDWARE/SOFTWARE
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