W25X40CLUXIG

W25X40CLUXIG

HVSON, SOLCC8,.11,20

Call for availability

Manufactured by:

WINBOND

Mfr Part#:  W25X40CLUXIG

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON, SOLCC8,.11,20

PACKAGE EQUIVALENCE CODE:  SOLCC8,.11,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

PART PACKAGE CODE:  SON

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  IT ALSO OPERATES AT 2.3 V AT 80 MHZ

CLOCK FREQUENCY-MAX (FCLK):  104 MHZ

DATA RETENTION TIME-MIN:  20

ENDURANCE:  100000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PDSO-N8

LENGTH:  3 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W25X40CLUXIG

MEMORY DENSITY:  4.1943 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  4MX1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVSON

PACKAGE DESCRIPTION:  HVSON, SOLCC8,.11,20

PACKAGE EQUIVALENCE CODE:  SOLCC8,.11,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  SON

PIN COUNT:  8

POWER SUPPLIES:  2.5/3.3 V

PROGRAMMING VOLTAGE:  2.7 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  600 ΜM

SERIAL BUS TYPE:  SPI

STANDBY CURRENT-MAX:  5 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  15 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TYPE:  NOR TYPE

WIDTH:  2 MM

WRITE PROTECTION:  HARDWARE/SOFTWARE

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