ACCESS TIME-MAX:  100 NS

COMMAND USER INTERFACE:  NO

DATA POLLING:  NO

JESD-30 CODE:  R-PQCC-J32

JESD-609 CODE:  E0

LENGTH:  13.97 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W27E257P-10

MEMORY DENSITY:  262.144 KBIT

MEMORY IC TYPE:  EEPROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  32

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  32KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QCCJ

PACKAGE DESCRIPTION:  QCCJ, LDCC32,.5X.6

PACKAGE EQUIVALENCE CODE:  LDCC32,.5X.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  CHIP CARRIER

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFJ

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  32

POWER SUPPLIES:  5 V

PROGRAMMING VOLTAGE:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  3.56 MM

STANDBY CURRENT-MAX:  100 ΜA

SUBCATEGORY:  EEPROMS

SUPPLY CURRENT-MAX:  30 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  J BEND

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

TOGGLE BIT:  NO

WIDTH:  11.43 MM