ACCESS TIME-MAX:  70 NS

BOOT BLOCK:  BOTTOM/TOP

COMMAND USER INTERFACE:  YES

DATA POLLING:  YES

ENDURANCE:  10000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PQCC-J32

JESD-609 CODE:  E0

LENGTH:  13.97 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W39L040AP70B

MEMORY DENSITY:  4.1943 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF SECTORS/SIZE:  8

NUMBER OF TERMINALS:  32

NUMBER OF WORDS:  524.288 K

NUMBER OF WORDS CODE:  512000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  512KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QCCJ

PACKAGE DESCRIPTION:  QCCJ, LDCC32,.5X.6

PACKAGE EQUIVALENCE CODE:  LDCC32,.5X.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  CHIP CARRIER

PAGE SIZE:  4K WORDS

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  QFJ

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  32

POWER SUPPLIES:  3.3 V

PROGRAMMING VOLTAGE:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  3.56 MM

SECTOR SIZE:  64K

STANDBY CURRENT-MAX:  5 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  30 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  J BEND

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

TOGGLE BIT:  YES

TYPE:  NOR TYPE

WIDTH:  11.43 MM