W78E858-40

W78E858-40

DIP, DIP40,.6

Call for availability

Manufactured by:

WINBOND

Mfr Part#:  W78E858-40

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP40,.6

PACKAGE EQUIVALENCE CODE:  DIP40,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BIT SIZE:  8

CPU FAMILY:  8051

JESD-30 CODE:  R-PDIP-T40

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W78E858-40

NUMBER OF TERMINALS:  40

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP40,.6

PACKAGE EQUIVALENCE CODE:  DIP40,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  768

ROM (WORDS):  32768

ROM PROGRAMMABILITY:  FLASH

SPEED:  20 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  20 MA

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

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