W83L950D

W83L950D

QFP, QFP80,.55SQ,20

Call for availability

Manufactured by:

WINBOND

Mfr Part#:  W83L950D

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP80,.55SQ,20

PACKAGE EQUIVALENCE CODE:  QFP80,.55SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PQFP-G80

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W83L950D

NUMBER OF TERMINALS:  80

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  QFP

PACKAGE DESCRIPTION:  QFP, QFP80,.55SQ,20

PACKAGE EQUIVALENCE CODE:  QFP80,.55SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK

POWER SUPPLIES:  3.3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  OTHER MICROPROCESSOR ICS

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR CIRCUIT

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*