XC17S20PDG8C

XC17S20PDG8C

DIP

Call for availability

Manufactured by:

XILINX

Mfr Part#:  XC17S20PDG8C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDIP-T8

JESD-609 CODE:  E3

LENGTH:  9.3599 MM

MANUFACTURER:  XILINX

MANUFACTURER PART NUMBER:  XC17S20PDG8C

MEMORY DENSITY:  178.144 KBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  1

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  178.144 K

NUMBER OF WORDS CODE:  178144

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  178144X1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  250

PIN COUNT:  8

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  4.5974 MM

SUPPLY VOLTAGE-MAX (VSUP):  5.25 V

SUPPLY VOLTAGE-MIN (VSUP):  4.75 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  MATTE TIN (SN)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  7.62 MM

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