XC17S50XLSO20C

XC17S50XLSO20C

SOP, SOP20,.4

Call for availability

Manufactured by:

XILINX

Mfr Part#:  XC17S50XLSO20C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP20,.4

PACKAGE EQUIVALENCE CODE:  SOP20,.4

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CLOCK FREQUENCY-MAX (FCLK):  10 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-PDSO-G20

JESD-609 CODE:  E0

LENGTH:  12.8 MM

MANUFACTURER:  XILINX

MANUFACTURER PART NUMBER:  XC17S50XLSO20C

MEMORY DENSITY:  559.232 KBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  1

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  20

NUMBER OF WORDS:  559.232 K

NUMBER OF WORDS CODE:  559232

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  559232X1

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP20,.4

PACKAGE EQUIVALENCE CODE:  SOP20,.4

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

PIN COUNT:  20

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.65 MM

STANDBY CURRENT-MAX:  50 ΜA

SUBCATEGORY:  OTP ROMS

SUPPLY CURRENT-MAX:  5 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN85PB15)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

WIDTH:  7.5 MM

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