ADDITIONAL FEATURE:  REAL DIGITAL DESIGN TECHNOLOGY

IN-SYSTEM PROGRAMMABLE:  YES

JESD-30 CODE:  S-PBGA-B56

JESD-609 CODE:  E0

JTAG BST:  YES

LENGTH:  6 MM

MANUFACTURER:  XILINX

MANUFACTURER PART NUMBER:  XC2C32-6CP56I

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF DEDICATED INPUTS:  1

NUMBER OF I/O LINES:  33

NUMBER OF MACRO CELLS:  32

NUMBER OF TERMINALS:  56

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  1 DEDICATED INPUTS, 33 I/O

OUTPUT FUNCTION:  MACROCELL

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA, BGA56,10X10,20

PACKAGE EQUIVALENCE CODE:  BGA56,10X10,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  56

POWER SUPPLIES:  1.5/3.3,1.8 V

PROGRAMMABLE LOGIC TYPE:  FLASH PLD

PROPAGATION DELAY:  6 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.35 MM

SUBCATEGORY:  PROGRAMMABLE LOGIC DEVICES

SUPPLY VOLTAGE-MAX:  1.9 V

SUPPLY VOLTAGE-MIN:  1.7 V

SUPPLY VOLTAGE-NOM:  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN63PB37)

TERMINAL FORM:  BALL

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  6 MM