XC2S200E-6FTG256I
BGA, BGA256,16X16,40Call for availability
Manufactured by:
Mfr Part#: XC2S200E-6FTG256I
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA256,16X16,40
PACKAGE EQUIVALENCE CODE: BGA256,16X16,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: MAXIMUM USABLE GATES = 200000
CLOCK FREQUENCY-MAX: 357 MHZ
COMBINATORIAL DELAY OF A CLB-MAX: 470 PS
JESD-30 CODE: S-PBGA-B256
JESD-609 CODE: E1
LENGTH: 17 MM
MANUFACTURER: XILINX
MANUFACTURER PART NUMBER: XC2S200E-6FTG256I
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF CLBS: 1176
NUMBER OF EQUIVALENT GATES: 71000
NUMBER OF INPUTS: 289
NUMBER OF LOGIC CELLS: 5292
NUMBER OF OUTPUTS: 289
NUMBER OF TERMINALS: 256
ORGANIZATION: 1176 CLBS, 71000 GATES
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA256,16X16,40
PACKAGE EQUIVALENCE CODE: BGA256,16X16,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 256
POWER SUPPLIES: 1.2/3.6,1.8 V
PROGRAMMABLE LOGIC TYPE: FIELD PROGRAMMABLE GATE ARRAY
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2 MM
SUBCATEGORY: FIELD PROGRAMMABLE GATE ARRAYS
SUPPLY VOLTAGE-MAX: 1.89 V
SUPPLY VOLTAGE-MIN: 1.71 V
SUPPLY VOLTAGE-NOM: 1.8 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TERMINAL FINISH: TIN/SILVER/COPPER (SN95.5AG4.0CU0.5)
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 17 MM
Related Products
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .