XC2S400E-6FG456I
BGA, BGA456,22X22,40Call for availability
Manufactured by:
Mfr Part#: XC2S400E-6FG456I
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA456,22X22,40
PACKAGE EQUIVALENCE CODE: BGA456,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: MAXIMUM USABLE GATES = 150000
CLOCK FREQUENCY-MAX: 357 MHZ
COMBINATORIAL DELAY OF A CLB-MAX: 470 PS
JESD-30 CODE: S-PBGA-B456
JESD-609 CODE: E0
LENGTH: 23 MM
MANUFACTURER: XILINX
MANUFACTURER PART NUMBER: XC2S400E-6FG456I
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF CLBS: 864
NUMBER OF EQUIVALENT GATES: 52000
NUMBER OF INPUTS: 410
NUMBER OF LOGIC CELLS: 10800
NUMBER OF OUTPUTS: 410
NUMBER OF TERMINALS: 456
ORGANIZATION: 864 CLBS, 52000 GATES
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA456,22X22,40
PACKAGE EQUIVALENCE CODE: BGA456,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): 225
PIN COUNT: 456
POWER SUPPLIES: 1.2/3.6,1.8 V
PROGRAMMABLE LOGIC TYPE: FIELD PROGRAMMABLE GATE ARRAY
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.6 MM
SUBCATEGORY: FIELD PROGRAMMABLE GATE ARRAYS
SUPPLY VOLTAGE-MAX: 1.89 V
SUPPLY VOLTAGE-MIN: 1.71 V
SUPPLY VOLTAGE-NOM: 1.8 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TERMINAL FINISH: TIN/LEAD (SN63PB37)
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 23 MM
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MFR. Name: Xilinx
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