XC3S1500L-4FG456C
BGA, BGA456,22X22,40Call for availability
Manufactured by:
Mfr Part#: XC3S1500L-4FG456C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA456,22X22,40
PACKAGE EQUIVALENCE CODE: BGA456,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: S-PBGA-B456
JESD-609 CODE: E0
LENGTH: 23 MM
MANUFACTURER: XILINX
MANUFACTURER PART NUMBER: XC3S1500L-4FG456C
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF CLBS: 3328
NUMBER OF EQUIVALENT GATES: 1500000
NUMBER OF INPUTS: 333
NUMBER OF LOGIC CELLS: 29952
NUMBER OF OUTPUTS: 333
NUMBER OF TERMINALS: 456
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 3328 CLBS, 1500000 GATES
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA456,22X22,40
PACKAGE EQUIVALENCE CODE: BGA456,22X22,40
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY
PART PACKAGE CODE: BGA
PIN COUNT: 456
POWER SUPPLIES: 1.2,1.2/3.3,2.5 V
PROGRAMMABLE LOGIC TYPE: FIELD PROGRAMMABLE GATE ARRAY
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 2.6 MM
SUBCATEGORY: FIELD PROGRAMMABLE GATE ARRAYS
SUPPLY VOLTAGE-NOM: 1.2 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: OTHER
TERMINAL FINISH: TIN/LEAD (SN63PB37)
TERMINAL FORM: BALL
TERMINAL PITCH: 1 MM
TERMINAL POSITION: BOTTOM
WIDTH: 23 MM
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