XC6SLX45-3CSG484C
FBGA, BGA484,22X22,32Call for availability
Manufactured by:
Mfr Part#: XC6SLX45-3CSG484C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: FBGA
PACKAGE DESCRIPTION: FBGA, BGA484,22X22,32
PACKAGE EQUIVALENCE CODE: BGA484,22X22,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CLOCK FREQUENCY-MAX: 862 MHZ
COMBINATORIAL DELAY OF A CLB-MAX: 210 PS
JESD-30 CODE: S-PBGA-B484
JESD-609 CODE: E1
LENGTH: 19 MM
MANUFACTURER: XILINX
MANUFACTURER PART NUMBER: XC6SLX45-3CSG484C
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF CLBS: 3411
NUMBER OF INPUTS: 310
NUMBER OF LOGIC CELLS: 43661
NUMBER OF OUTPUTS: 310
NUMBER OF TERMINALS: 484
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: 0 °C
ORGANIZATION: 3411 CLBS
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: FBGA
PACKAGE DESCRIPTION: FBGA, BGA484,22X22,32
PACKAGE EQUIVALENCE CODE: BGA484,22X22,32
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: GRID ARRAY, FINE PITCH
PART PACKAGE CODE: BGA
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 484
POWER SUPPLIES: 1.2,2.5/3.3 V
PROGRAMMABLE LOGIC TYPE: FIELD PROGRAMMABLE GATE ARRAY
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.8 MM
SUBCATEGORY: FIELD PROGRAMMABLE GATE ARRAYS
SUPPLY VOLTAGE-MAX: 1.26 V
SUPPLY VOLTAGE-MIN: 1.14 V
SUPPLY VOLTAGE-NOM: 1.2 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: OTHER
TERMINAL FINISH: TIN/SILVER/COPPER (SN/AG/CU)
TERMINAL FORM: BALL
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: BOTTOM
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 19 MM
Related Products
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
MFR. Name: Xilinx
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