XCF01SVO20C

XCF01SVO20C

TSSOP, TSSOP20,.25

Call for availability

Manufactured by:

XILINX

Mfr Part#:  XCF01SVO20C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP20,.25

PACKAGE EQUIVALENCE CODE:  TSSOP20,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

DATA RETENTION TIME-MIN:  20

ENDURANCE:  20000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PDSO-G20

JESD-609 CODE:  E0

LENGTH:  6.5024 MM

MANUFACTURER:  XILINX

MANUFACTURER PART NUMBER:  XCF01SVO20C

MEMORY DENSITY:  1.0486 MBIT

MEMORY IC TYPE:  CONFIGURATION MEMORY

MEMORY WIDTH:  1

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  20

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  1MX1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP20,.25

PACKAGE EQUIVALENCE CODE:  TSSOP20,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  TSSOP

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  20

POWER SUPPLIES:  1.8/3.3,3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.19 MM

STANDBY CURRENT-MAX:  1 MA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  10 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN85PB15)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

TYPE:  NOR TYPE

WIDTH:  4.4 MM

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