XCF01SVO20C
TSSOP, TSSOP20,.25Call for availability
Mfr Part#: XCF01SVO20C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP20,.25
PACKAGE EQUIVALENCE CODE: TSSOP20,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
DATA RETENTION TIME-MIN: 20
ENDURANCE: 20000 WRITE/ERASE CYCLES
JESD-30 CODE: R-PDSO-G20
JESD-609 CODE: E0
LENGTH: 6.5024 MM
MANUFACTURER: XILINX
MANUFACTURER PART NUMBER: XCF01SVO20C
MEMORY DENSITY: 1.0486 MBIT
MEMORY IC TYPE: CONFIGURATION MEMORY
MEMORY WIDTH: 1
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 20
NUMBER OF WORDS: 1.0486 M
NUMBER OF WORDS CODE: 1000000
OPERATING MODE: SYNCHRONOUS
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
ORGANIZATION: 1MX1
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP20,.25
PACKAGE EQUIVALENCE CODE: TSSOP20,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PARALLEL/SERIAL: SERIAL
PART PACKAGE CODE: TSSOP
PBFREE CODE: NO
PEAK REFLOW TEMPERATURE (CEL): 225
PIN COUNT: 20
POWER SUPPLIES: 1.8/3.3,3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.19 MM
STANDBY CURRENT-MAX: 1 MA
SUBCATEGORY: FLASH MEMORIES
SUPPLY CURRENT-MAX: 10 ΜA
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 3 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN85PB15)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
TYPE: NOR TYPE
WIDTH: 4.4 MM
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