XCV50-5BGG256C

XCV50-5BGG256C

BGA

Call for availability

Manufactured by:

XILINX

Mfr Part#:  XCV50-5BGG256C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CLOCK FREQUENCY-MAX:  294 MHZ

COMBINATORIAL DELAY OF A CLB-MAX:  700 PS

JESD-30 CODE:  S-PBGA-B256

JESD-609 CODE:  E1

LENGTH:  27 MM

MANUFACTURER:  XILINX

MANUFACTURER PART NUMBER:  XCV50-5BGG256C

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF CLBS:  384

NUMBER OF EQUIVALENT GATES:  57906

NUMBER OF TERMINALS:  256

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  384 CLBS, 57906 GATES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  250

PIN COUNT:  256

PROGRAMMABLE LOGIC TYPE:  FIELD PROGRAMMABLE GATE ARRAY

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.55 MM

SUPPLY VOLTAGE-MAX:  2.625 V

SUPPLY VOLTAGE-MIN:  2.375 V

SUPPLY VOLTAGE-NOM:  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN/SILVER/COPPER (SN95.5AG4.0CU0.5)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  27 MM

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*