AM2964BDC

AM2964BDC

DIP, DIP40,.6

Call for availability

Manufactured by:

AMD

Mfr Part#:  AM2964BDC

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP40,.6

PACKAGE EQUIVALENCE CODE:  DIP40,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  16

BOUNDARY SCAN:  NO

EXTERNAL DATA BUS WIDTH:  0

JESD-30 CODE:  R-GDIP-T40

JESD-609 CODE:  E0

LENGTH:  52.2605 MM

LOW POWER MODE:  NO

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM2964BDC

MEMORY ORGANIZATION:  176K X 8

NUMBER OF BANKS:  4

NUMBER OF TERMINALS:  40

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP40,.6

PACKAGE EQUIVALENCE CODE:  DIP40,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  40

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.588 MM

SUBCATEGORY:  MEMORY CONTROLLERS

SUPPLY CURRENT-MAX:  173 MA

SUPPLY VOLTAGE-MAX:  5.25 V

SUPPLY VOLTAGE-MIN:  4.75 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  15.24 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MEMORY CONTROLLER, DRAM

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