A2F200M3F-FGG256
ARM® CORTEX®-M3 SYSTEM ON CHIP (SOC) IC SMARTFUSION® PROASIC®3 FPGA, 200K GATES, 4608 D-FLIP-FLOPS 256KB 64KB 80MHZ 256-FBGA (17X17)Call for availability
Manufactured by:
Mfr Part#: A2F200M3F-FGG256
PACKAGE / CASE: 256-LBGA
PACKAGING: TRAY
STANDARD PACKAGE: 1
SUPPLIER DEVICE PACKAGE: 256-FBGA (17X17)
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ARCHITECTURE: MCU, FPGA
BASE PART NUMBER: A2F200
CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: EBI/EMI, ETHERNET, I²C, SPI, UART/USART
CORE PROCESSOR: ARM® CORTEX®-M3
DETAILED DESCRIPTION: ARM® CORTEX®-M3 SYSTEM ON CHIP (SOC) IC SMARTFUSION® PROASIC®3 FPGA, 200K GATES, 4608 D-FLIP-FLOPS 256KB 64KB 80MHZ 256-FBGA (17X17)
FLASH SIZE: 256KB
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: MICROSEMI CORPORATION
MANUFACTURER PART NUMBER: A2F200M3F-FGG256
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: MCU - 25, FPGA - 66
OPERATING TEMPERATURE: 0°C ~ 85°C (TJ)
PACKAGE / CASE: 256-LBGA
PACKAGING: TRAY
PERIPHERALS: DMA, POR, WDT
PRIMARY ATTRIBUTES: PROASIC®3 FPGA, 200K GATES, 4608 D-FLIP-FLOPS
RAM SIZE: 64KB
SERIES: SMARTFUSION®
SPEED: 80MHZ
STANDARD PACKAGE: 1
SUPPLIER DEVICE PACKAGE: 256-FBGA (17X17)
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