A2F200M3F-FGG256

A2F200M3F-FGG256

ARM® CORTEX®-M3 SYSTEM ON CHIP (SOC) IC SMARTFUSION® PROASIC®3 FPGA, 200K GATES, 4608 D-FLIP-FLOPS 256KB 64KB 80MHZ 256-FBGA (17X17)

Call for availability

Manufactured by:

MICROSEMI

Mfr Part#:  A2F200M3F-FGG256

PACKAGE / CASE:  256-LBGA

PACKAGING:  TRAY

STANDARD PACKAGE:  1

SUPPLIER DEVICE PACKAGE:  256-FBGA (17X17)

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ARCHITECTURE:  MCU, FPGA

BASE PART NUMBER:  A2F200

CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  EBI/EMI, ETHERNET, I²C, SPI, UART/USART

CORE PROCESSOR:  ARM® CORTEX®-M3

DETAILED DESCRIPTION:  ARM® CORTEX®-M3 SYSTEM ON CHIP (SOC) IC SMARTFUSION® PROASIC®3 FPGA, 200K GATES, 4608 D-FLIP-FLOPS 256KB 64KB 80MHZ 256-FBGA (17X17)

FLASH SIZE:  256KB

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  A2F200M3F-FGG256

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  MCU - 25, FPGA - 66

OPERATING TEMPERATURE:  0°C ~ 85°C (TJ)

PACKAGE / CASE:  256-LBGA

PACKAGING:  TRAY

PERIPHERALS:  DMA, POR, WDT

PRIMARY ATTRIBUTES:  PROASIC®3 FPGA, 200K GATES, 4608 D-FLIP-FLOPS

RAM SIZE:  64KB

SERIES:  SMARTFUSION®

SPEED:  80MHZ

STANDARD PACKAGE:  1

SUPPLIER DEVICE PACKAGE:  256-FBGA (17X17)

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