Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ARCHITECTURE: MCU, FPGA
CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CANBUS, ETHERNET, I²C, SPI, UART/USART, USB
CORE PROCESSOR: ARM® CORTEX®-M3
DETAILED DESCRIPTION: ARM® CORTEX®-M3 SYSTEM ON CHIP (SOC) IC SMARTFUSION®2 FPGA - 50K LOGIC MODULES 256KB 64KB 166MHZ 484-FPBGA (23X23)
FLASH SIZE: 256KB
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: MICROSEMI CORPORATION
MANUFACTURER PART NUMBER: M2S050T-FGG484I
MANUFACTURER STANDARD LEAD TIME: 11 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 267
OPERATING TEMPERATURE: -40°C ~ 100°C (TJ)
PACKAGE / CASE: 484-BGA
PACKAGING: TRAY
PERIPHERALS: DDR, PCIE, SERDES
PRIMARY ATTRIBUTES: FPGA - 50K LOGIC MODULES
RAM SIZE: 64KB
SERIES: SMARTFUSION®2
SPEED: 166MHZ
STANDARD PACKAGE: 60
SUPPLIER DEVICE PACKAGE: 484-FPBGA (23X23)
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