MRF5007R1

MRF5007R1

CHIP CARRIER, R-CBCC-N3

Call for availability

Manufactured by:

MOTOROLA

Mfr Part#:  MRF5007R1

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE DESCRIPTION:  CHIP CARRIER, R-CBCC-N3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  CHIP CARRIER

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CONFIGURATION:  SINGLE

DS BREAKDOWN VOLTAGE-MIN:  25 V

DRAIN CURRENT-MAX (ABS) (ID):  4.5 A

DRAIN CURRENT-MAX (ID):  4.5 A

FET TECHNOLOGY:  METAL-OXIDE SEMICONDUCTOR

FEEDBACK CAP-MAX (CRSS):  16 PF

HIGHEST FREQUENCY BAND:  ULTRA HIGH FREQUENCY BAND

JESD-30 CODE:  R-CBCC-N3

MANUFACTURER:  MOTOROLA SEMICONDUCTOR PRODUCTS

MANUFACTURER PART NUMBER:  MRF5007R1

NUMBER OF ELEMENTS:  1

NUMBER OF TERMINALS:  3

OPERATING MODE:  ENHANCEMENT MODE

OPERATING TEMPERATURE-MAX:  200 °C

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE DESCRIPTION:  CHIP CARRIER, R-CBCC-N3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  CHIP CARRIER

POLARITY/CHANNEL TYPE:  N-CHANNEL

POWER DISSIPATION AMBIENT-MAX:  25 W

POWER GAIN-MIN (GP):  10 DB

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  FET GENERAL PURPOSE POWER

SURFACE MOUNT:  YES

TERMINAL FORM:  NO LEAD

TERMINAL POSITION:  BOTTOM

TRANSISTOR APPLICATION:  AMPLIFIER

TRANSISTOR ELEMENT MATERIAL:  SILICON

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