TSPC106AMGU66CG
BGA, BGA303,19X16,50Call for availability
Manufactured by:
Mfr Part#: TSPC106AMGU66CG
PACKAGE BODY MATERIAL: CERAMIC
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA303,19X16,50
PACKAGE EQUIVALENCE CODE: BGA303,19X16,50
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
JESD-30 CODE: R-XBGA-B303
JESD-609 CODE: E0
MANUFACTURER: THOMSON-CSF COMPSANTS SPECIFIC
MANUFACTURER PART NUMBER: TSPC106AMGU66CG
NUMBER OF TERMINALS: 303
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -55 °C
PACKAGE BODY MATERIAL: CERAMIC
PACKAGE CODE: BGA
PACKAGE DESCRIPTION: BGA, BGA303,19X16,50
PACKAGE EQUIVALENCE CODE: BGA303,19X16,50
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY
POWER SUPPLIES: 3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: MEMORY CONTROLLERS
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: MILITARY
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: BALL
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: BOTTOM
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