XC7Z035-L2FBG676I
DUAL ARM® CORTEX®-A9 MPCORE? WITH CORESIGHT? SYSTEM ON CHIP (SOC) IC ZYNQ®-7000 KINTEX?-7 FPGA, 275K LOGIC CELLS 256KB 800MHZ 676-FCBGA (27X27)Call for availability
Manufactured by:
Mfr Part#: XC7Z035-L2FBG676I
PACKAGE / CASE: 676-BBGA, FCBGA
PACKAGING: TRAY
STANDARD PACKAGE: 1
SUPPLIER DEVICE PACKAGE: 676-FCBGA (27X27)
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ARCHITECTURE: MCU, FPGA
CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CAN, EBI/EMI, ETHERNET, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
CORE PROCESSOR: DUAL ARM® CORTEX®-A9 MPCORE? WITH CORESIGHT?
DETAILED DESCRIPTION: DUAL ARM® CORTEX®-A9 MPCORE? WITH CORESIGHT? SYSTEM ON CHIP (SOC) IC ZYNQ®-7000 KINTEX?-7 FPGA, 275K LOGIC CELLS 256KB 800MHZ 676-FCBGA (27X27)
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: XILINX INC.
MANUFACTURER PART NUMBER: XC7Z035-L2FBG676I
MANUFACTURER STANDARD LEAD TIME: 6 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 130
OPERATING TEMPERATURE: -40°C ~ 100°C (TJ)
PACKAGE / CASE: 676-BBGA, FCBGA
PACKAGING: TRAY
PERIPHERALS: DMA
PRIMARY ATTRIBUTES: KINTEX?-7 FPGA, 275K LOGIC CELLS
RAM SIZE: 256KB
SERIES: ZYNQ®-7000
SPEED: 800MHZ
STANDARD PACKAGE: 1
SUPPLIER DEVICE PACKAGE: 676-FCBGA (27X27)
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