XCZU3EG-1SFVC784E
QUAD ARM® CORTEX®-A53 MPCORE? WITH CORESIGHT?, DUAL ARM®CORTEX?-R5 WITH CORESIGHT? SYSTEM ON CHIP (SOC) IC ZYNQ® ULTRASCALE+? MPSOC EG ZYNQ®ULTRASCALE+? FPGA, 154K+ LOGIC CELLS 256KB 600MHZ, 1.5GHZ 784-FCBGA (23X23)Call for availability
Manufactured by:
Mfr Part#: XCZU3EG-1SFVC784E
PACKAGE / CASE: 784-BBGA, FCBGA
PACKAGING: TRAY
STANDARD PACKAGE: 1
SUPPLIER DEVICE PACKAGE: 784-FCBGA (23X23)
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ARCHITECTURE: MCU, FPGA
CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CAN, EBI/EMI, ETHERNET, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
CORE PROCESSOR: QUAD ARM® CORTEX®-A53 MPCORE? WITH CORESIGHT?, DUAL ARM®CORTEX?-R5 WITH CORESIGHT?
DETAILED DESCRIPTION: QUAD ARM® CORTEX®-A53 MPCORE? WITH CORESIGHT?, DUAL ARM®CORTEX?-R5 WITH CORESIGHT? SYSTEM ON CHIP (SOC) IC ZYNQ® ULTRASCALE+? MPSOC EG ZYNQ®ULTRASCALE+? FPGA, 154K+ LOGIC CELLS 256KB 600MHZ, 1.5GHZ 784-FCBGA (23X23)
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: XILINX INC.
MANUFACTURER PART NUMBER: XCZU3EG-1SFVC784E
MANUFACTURER STANDARD LEAD TIME: 6 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 4 (72 HOURS)
NUMBER OF I/O: 252
OPERATING TEMPERATURE: 0°C ~ 100°C (TJ)
PACKAGE / CASE: 784-BBGA, FCBGA
PACKAGING: TRAY
PERIPHERALS: DMA, WDT
PRIMARY ATTRIBUTES: ZYNQ®ULTRASCALE+? FPGA, 154K+ LOGIC CELLS
RAM SIZE: 256KB
SERIES: ZYNQ® ULTRASCALE+? MPSOC EG
SPEED: 600MHZ, 1.5GHZ
STANDARD PACKAGE: 1
SUPPLIER DEVICE PACKAGE: 784-FCBGA (23X23)
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